TEST CAPABILITY BY SPECIFICATION & TEST METHODS


SPECIFICATION : MIL-STD-202

SPECIFICATION /PARAGRAPH

TEST NAME
103 B
HUMIDITY ; STEADY STATE
104
IMMERSION
106 F MOISTURE RESISTANCE
107 G THERMAL SHOCK
208 SOLDERABILITY
210 RESISTANCE TO SOLDERING HEAT
211 TERMINAL STRENGTH
215 RESISTANCE TO SOLVENTS
301 DIELECTRIC WITHSTANDING VOLTAGE
302 INSULATION RESISTANCE
303 DC RESISTANCE
304 RESISTANCE - TEMPERATURE CHARACTERISTIC
307 CONTACT RESISTANCE

 

MIL-STD-883

SPECIFICATION /PARAGRAPH

TEST NAME
1002
IMMERSION
1003
INSULATION RESISTANCE
1004 MOISTURE & INSULATION RESISTANCE
1005.8 STEADY STATE LIFE
1006 INTERMITTENT LIFE
1008.2 STABILIZATION BAKE
1010.7 THERMAL SHOCK
2003.7 SOLDERABILITY
2004.5 LEAD INTEGRITY
2011.7 BOND STRENGTH
2015.11 RESISTANCE TO SOLVENTS
3005.1 POWER SUPPLY CURRENT

 

MIL-PRF-55110 ; MIL-P-50884 ; MIL-PRF-31032 ; IPC-TM-650

SPECIFICATION /PARAGRAPH

TEST NAME
MIL-PRF-55110
WHOLE SPECIFICATION
MIL-P-50884
WHOLE SPECIFICATION
MIL-PRF-31032 WHOLE SPECIFICATION
IPC -TM-650 IN ADDITION TO THE ONES USED IN THE ABOVE MENTIONED SPECIFICATIONS
2.2.17 SURFACE ROUGHNESS & PROFILE OF METALLIC SURFACES
2.4.1 ADHESION TAPE TEST
2.4.1.1 ADHESION MARKING PAINTS & INKS
2.4.1.2 ADHESION OF CONDUCTORS ON HYBRIDS
2.4.1.3 ADHESION OF RESISTORS ; HYBRID CIR.
2.4.1.6 ADHESION OF POLYMER COATINGS
2.4.12 SOLDERABILITY EDGE STRIP
2.4.13 SOLDER FLOAT RESISTANCE FLEXIBLE PRINTED WIRING MATERIAL
2.4.13.1 THERMAL STRESS OF LAMINATES
2.4.14 SOLDERABILITY OF METALLIC SURFACES
2.4.18 TENSILE STRENGTH , ELONGATION OF CU. FOIL
2.4.19 TENSILE STRENGTH, ELONGATION FLEXIBLE PRINTED WIRING
2.4.20 TERMINAL BOND STRENGTH : FLEX CIR.
2.4.21 LAND BOND STRENGTH : UNSUPPORTED COMPONENT HOLES
2.4.21.1 BOND STRENGTH ; SURFACE MOUNT LANDS PERPENDICULAR PULL METHOD
2.4.27.2 SOLDER MASK ABRASION ( PENCIL METHOD)
2.4.28 ADHESION, SOLDER MASK ( NON-MELTING METHOD)
2.4.28.1 ADHESION, SOLDER RESIST (MASK) TAPE TEST
2.4.40 INNERLAYER BOND STRENGTH OF MULTILAYER P.C. BOARDS
2.5.3 CURRENT BREAKDOWN PLATED THROUGH HOLES
2.5.9 INSULATION RESISTANCE ; FLEXIBLE PRINTED WIRING
2.5.10 INSULATION RESISTANCE ; MULTILAYER P.W.B ; MOISTURE
2.5.11 INSULATION RESISTANCE ; MULTILAYER WITHIN LAYERS
2.5.12 INTERCONNECTION RESISTANCE
2.5.16 SHORTS , INTERNAL ON MULTILAYER PWB.
2.5.17 VOLUME & SURFACE RESISTIVITY OF P.W. LAMINATES
2.5.23 INSULATION RESISTANCE & MOISTURE RESISTANCE OF SOLDER MASKS
2.5.27 SURFACE INSULATION RESISTANCE OF RAW P.W.B
2.5.32 RESISTANCE TEST, PLATED THROUGH HOLES
2.6.3.3A SURFACE INSULATION RESISTANCE / FLUXES
2.6.6 TEMPERATURE CYCLING : P.W.B
2.6.11 HYDROLYTIC STABILITY SOLDER MASK & CONFORMAL COATING.
2.6.12 TEMPERATURE TESTING, FLEXIBLE FLAT CABLES
2.6.13 ASSESSMENT OF SUSCEPTIBLITY TO METALLIC DENDRITIC GROWTH OF
UNCOATED PRINTED WIRING
2.6.17 HYDROLYTIC STABILITY, FLEXIBLE P.W
2.6.19 ENVIRONMENTAL & INSULATION RESISTANCE OF HYBRID CERAMIC
MULTILAYER SUBSTRATE BOARDS.
3.1 CONTACT RESISTANCE CONNECTORS
3.3 CRIMP TENSILE STRENGTH , CONNECTORS
3.5 INSULATION RESISTANCE : CONNECTORS
3.10 SOLDERABILITY , CONNECTORS
3.11 THERMAL SHOCK ; CONNECTORS
3.13 DIELECTRIC WITHSTANDING VOLTAGE ; CONNECTORS
3.14 HIGH TEMPERATURE LIFE ; CONNECTORS
3.18 MATING & UN MATING FORCE ; CONNECTORS

 

ANSI-J-STD-001
ANSI-J-STD-002
ANSI-J-STD-003
ANSI-J-STD-004
ANSI-NCSL-Z540-1994


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